Venture Clienting with ebm-papst – Shape the Future of Chip Cooling
ebm papst is looking for partners to co-develop next-generation chip cooling solutions that set new benchmarks in thermal performance and energy efficiency for AI workloads. Selected innovators get access to engineering expertise and lab environments — enabling rapid PoCs and a clear path toward scalable venture clienting partnerships.
Who can participate?
All innovators working on advanced chip cooling systems with a functional or testable solution — including startups, scaleups, established technology companies, research teams, and independent engineering groups.
If your cooling concept uses a liquid cooling medium and targets high-performance computing or AI data centers, it is in scope.
#ChipCooling #VentureClienting #DeepTech #InnovateTogether
🏆 Prize Co-Development + Scaling + Long-Term Partnership
🕑 Deadline Feb 10, 2026, 10:59 PM🌎 Scope Global
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Status Quo
You will find all information regarding the business problem and context of the project.
Current State
AI accelerators and other high-performance computing chips are massively increasing heat loads in data centers. Next-generation cooling concepts – for example direct-to-chip solutions, immersion-style systems, two-phase approaches or advanced air–liquid hybrids – are emerging to keep pace.
ebm papst, a global leader in airflow, is developing new products for the next generation of data-center cooling systems. These products are meant to work seamlessly with next-gen chip cooling technologies and support highly efficient, scalable cooling architectures for AI data centers.
Opportunity Definition
While many innovative chip-cooling solutions are emerging, their full potential in combination within optimized systems, this area is still largely untapped. There is no widely established “reference setup” that showcases how cutting-edge cooling concepts and industrial grade heating and cooling quipment can work together to maximize performance, efficiency and reliability.
This project is therefore an opportunity for innovators in chip cooling to partner with ebm papst, connect their technology with a high-performance industrial heating and cooling equipment , and jointly shape showcase systems and future-ready cooling solutions for the rapidly growing AI data-center market.