Venture Clienting with ebm-papst – Shape the Future of Chip Cooling
ebm papst is looking for partners to co-develop next-generation chip cooling solutions that set new benchmarks in thermal performance and energy efficiency for AI workloads. Selected innovators get access to engineering expertise and lab environments — enabling rapid PoCs and a clear path toward scalable venture clienting partnerships.
Who can participate?
All innovators working on advanced chip cooling systems with a functional or testable solution — including startups, scaleups, established technology companies, research teams, and independent engineering groups.
If your cooling concept uses a liquid cooling medium and targets high-performance computing or AI data centers, it is in scope.
#ChipCooling #VentureClienting #DeepTech #InnovateTogether
🏆 Prize Co-Development + Scaling + Long-Term Partnership
🕑 Deadline Feb 10, 2026, 10:59 PM🌎 Scope Global
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Process
ebm papst follows a structured Venture Client process to evaluate, compare and pilot different solution approaches.
1. Application via Platform
Solution providers submit their application through the ekipa platform until the deadline.
2. Get-to-Know Conversations
Short digital sessions (30–45 minutes) with selected providers to:
- clarify open questions
- understand your cooling concept, current maturity and reference deployments
- discuss technical integration with advanced liquid cooling components and available performance data
- outline a first PoC idea (lab setup, roles, timeline) and discuss expected value and early assumptionsThis step ensures both sides know what a collaboration could look like.
3. Kick-Off Workshop & Scoping
Selected providers join an on-site or virtual workshop to:
- align on success criteria (technical, commercial, and data-related)
- define the cooling concept’s operating envelope together with ebm papst (temperatures, pressures, flow ranges, fluid type, cleanliness levels)
- specify the integration of an advanced liquid cooling components into the cooling loop, including interfaces, sensors and required lab setups
- clarify responsibilities, milestones and expected deliverables on both sides
- finalize the PoC and testing scope, timeline, setup and potential costs.
The outcome is a clear joint plan for the PoC.
4. Boost Phase
The Proof-of-concept (PoC) should focus on:
- validating cooling performance and stability of your solution together with advanced liquid cooling components under real or simulated data-center conditions
- refining the operating envelope (temperature ranges, pressures, flow rates, cleanliness levels) and confirming the most relevant duty points for future chip cooling components
- collecting structured measurement data (for example temperatures, pressures, flow, energy consumption) to further populate and sharpen the ebm papst evaluation matrix
- testing integration, control and operation of the joint setup, including start-up behaviour, dynamic load changes and typical service/maintenance procedures
- deriving first business insights such as expected efficiency gains, retrofit potential and indicative component volumes for different cooling concepts and customer segments
5. Rollout Evaluation & Next Steps
Based on PoC performance, ebm papst decides on:
- extension of the PoC
- possible co-development steps
- commercial model and scaling roadmap